PCBA & IC Packaging

Semiconductor Packaging Technology Fair

Shenzhen, China

27-29 October 2026

85 days left

ABOUT THE FAIR

The PCBA & IC Packaging exhibition, also known as the Semiconductor Packaging Technology Fair, is among the premier trade shows for the electronics industry in Asia and is a component of NEPCON ASIA. It is organized annually by RX China at the Shenzhen World Convention and Exhibition Center. This exhibition brings together exhibitors and brands from the entire electronic manufacturing chain. The range of offerings extends from electronic components and PCBA processes to smart manufacturing, EMS services, and semiconductor packaging. A particular highlight is the concurrently held exhibitions, which provide visitors with cross-industry business opportunities in various sectors. These include consumer electronics, household appliances, industrial control, communication, the automotive industry, touch displays, renewable energy, medical devices, and optoelectronics. Hence, the trade show serves as an ideal platform to explore the latest trends and innovations of the Asian electronics industry. Shenzhen, being a high-tech metropolis and the hub of electronic production in China, emphasizes the significance of this exhibition with its strategic advantages. The Shenzhen World Convention and Exhibition Center boasts state-of-the-art infrastructure and excellent transport links, offering the perfect setting for exhibitors and visitors to conduct business and stay informed about recent developments. In conclusion, the PCBA & IC Packaging exhibition is not only an excellent opportunity to learn about the latest trends and technologies in the electronics industry but also a pivotal event to grasp the future direction and vitality of the Asian electronics sector. It's a must-attend for all professionals active in this dynamic industry. The PCBA & IC Packaging will take place on 3 days from Tuesday, 27. October to Thursday, 29. October 2026 in Shenzhen.