PACK EXPO

Trade fair for innovative packaging machines, materials and technologies

Kuala Lumpur, Malaysia

18-21 August 2026

Labeling Packaging Packaging Technology Packing Machines Printing and Publishing Printing Technology

15 days left

ABOUT THE FAIR

The PACK EXPO is among the leading trade fairs for innovative packaging solutions, covering the entire spectrum of packaging and processing technologies. The name "PACK EXPO" stands for "Packaging Exposition", highlighting the comprehensive presentation of the latest technologies and materials in the packaging industry. The PACK EXPO is held annually at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur. The organizer, MTE Exhibition Sdn Bhd, deliberately chooses this dynamic city, known for its growing industry and as a trade hub in Southeast Asia, to bring together local and international professionals. The fair features topics such as automation and control, packaging machinery and materials, food and beverage processing, life sciences processing equipment, and chemicals. It showcases the latest technologies specifically developed for sectors like food, beverages, chemicals, and life sciences. As a central platform for business matchmaking, the fair facilitates valuable networking opportunities through conferences, panel discussions, and career platforms. Experts and industry leaders share their knowledge, while aspiring engineers gain insights into various fields and forge connections. Exhibitors and visitors range from engineers and developers to decision-makers in multinational companies. MITEC, with its modern architecture and excellent infrastructure, provides ideal conditions for hosting PACK EXPO. Its proximity to Kuala Lumpur's city center allows visitors and exhibitors to take advantage of the metropolis's cultural and culinary offerings. The PACK EXPO will take place on 4 days from Tuesday, 18. August to Friday, 21. August 2026 in Kuala Lumpur.

FAIR LOCATION

MITEC Malaysia International Trade & Exhibition Centre

Kuala Lumpur, Malaysia

FREQUENTLY ASKED QUESTIONS

The PACK EXPO fair takes place in Kuala Lumpur, at the MITEC Malaysia International Trade & Exhibition Centre.

Visit the PACK EXPO from 18. - 21. August 2026.

The PACK EXPO takes place annually.

The PACK EXPO is an exhibition for Packaging, Packing Machines and Packaging Technology.

SECTORS

Labeling

Packaging

Packaging Technology

Packing Machines

Printing and Publishing

Printing Technology

Contact us to get more information about the fair.

Our team will get back to you as soon as possible.

Fair Tours

Transfer and tour organization

Visa Application

Visa consulting and application support

Get Fair Ticket

Visitor and exhibitor tickets

Information Request Form

PACK EXPO fill out the form to get information about

FAIR INFORMATION

Date

18-21 August 2026
Period

Annually
Fair Contact

info@mtexpo.com.my
Target Audience

Yalnızca Profesyonel Ziyaretçiler
Local Time

22:28 h (UTC +08:00)

FAIR ORGANIZER

MTE Exhibition Sdn Bhd

Address

F-1-48 Jalan PJU 1A/3 Taipan Damansara, 2, Ara Damansara, 47301 Petaling Jaya, Malaysia, mtexpo.com.my
E-mail

info@mtexpo.com.my
Website

Unknown