ABOUT THE FAIR
The Print & Packtech World Expo is an annual flagship trade fair in India that has established itself as a key platform for innovation, investment, and emerging trends in the printing and packaging industries. The event takes place on the expansive grounds of the Palace Grounds in Bangalore – a prestigious venue located in the technological heart of the country. As a major industry gathering, the expo attracts trade visitors from across South Asia and beyond.
The event is organized by Triune Exhibitors Pvt. Ltd., a seasoned Indian trade fair organizer with extensive experience in staging specialized industry exhibitions. With its focused approach at the intersection of print and packaging technologies, the Print & Packtech World Expo offers an essential space for business development, networking, and knowledge exchange – particularly within the rapidly growing Indian market, which is playing an increasingly vital role in the global ecosystem.
The spotlight is on the latest developments in prepress and postpress technologies – from DTP and CTP solutions to color management, proofing, and high-performance machinery for offset, flexo, digital, and screen printing. Visitors experience firsthand how digital, sustainable, and automated technologies are reshaping the industry and securing its future. At the same time, the expo showcases cutting-edge advancements in packaging – ranging from thermoforming and vacuum packaging to pouch and cup production, as well as machines for processing paper, plastic, metal, and glass.
The trade fair offers a comprehensive overview of systems, materials, and services used throughout the entire value chain – from plate-making and bookbinding technologies to cutting systems, point-of-sale solutions, LED displays, barcode systems, and conveying equipment. This is further complemented by solutions for corrugated packaging, labeling, filling, and smart packaging technologies that are becoming increasingly important in the era of e-commerce and global logistics.
What sets the Print & Packtech World Expo apart is its direct relevance to India’s industrial development. As an emerging market with a growing demand for efficient and sustainable packaging, India offers not only vast economic potential but also an innovation-friendly environment. The expo reflects this momentum by highlighting synergies between print and packaging – whether in supply chain optimization, the use of green technologies, or the integration of design and functionality.
Exhibitors represent a broad spectrum of industries, including mechanical engineering, packaging design, print technology, materials, software, and automation. The audience is equally diverse: entrepreneurs, production managers, packaging developers, brand owners, procurement officers, and decision-makers from manufacturing, trade, and consumer goods sectors use the expo to monitor the market and initiate business contacts. Start-ups, OEMs, and export-oriented companies in particular benefit from valuable insights into technology trends and new partnership opportunities.
Located in the Palace Grounds of Bangalore, the venue lies at the heart of one of India’s most innovative metropolitan areas – often referred to as the “Silicon Valley of India.” The site is easily accessible via Kempegowda International Airport and well connected through the city's metro and bus network. Its location in the cultural and economic center of South India adds to the event’s appeal – making a visit to the Print & Packtech World Expo not only a business opportunity, but also a window into the future of global production.
The Print & Packtech World Expo takes place annually, and therefore for the 9th time previsibly in November 2026 in Bangalore.