IC & SENSOR PACKAGING EXPO

Trade fair on IC finishing and packaging

Tokyo, Japan

17-19 February 2027

Electrical Electronics Manufacturing Technology Packaging

195 days left

ABOUT THE FAIR

The ISP EXPO, also known as the IC & SENSOR PACKAGING EXPO, is a trade fair focusing on the final assembly and packaging of integrated circuits (ICs). This annual event was initiated by RX Japan Ltd. and has established itself as Asia's leading exhibition in this sector. The ISP EXPO is distinguished by its comprehensive presentation of advanced equipment, materials, and services specifically designed for IC final assembly and packaging. The expo provides a unique platform for industry professionals to stay informed about the latest technologies and trends, establish business relationships, and exchange knowledge. A key feature of the ISP EXPO is its integration with NEPCON Japan, one of the largest electronics trade fairs in Asia. This integration offers ISP EXPO participants an additional opportunity to connect with a broader range of industry experts and explore synergies with other areas of electronics manufacturing. The fair's venue, Tokyo Big Sight, is a renowned international exhibition center in Tokyo, known for its distinctive architecture and excellent facilities. It provides an ideal setting for this high-profile event, characterized by its high-quality exhibitions and professional audience. Highlights of the ISP EXPO include interactive lectures by industry leaders, demonstration areas for the latest products and technologies, and networking events that enable participants to establish contacts and explore business opportunities. The expo serves as an important platform for companies to showcase their latest innovations and stay informed about the challenges and opportunities in the IC packaging industry. The IC & SENSOR PACKAGING EXPO will take place on 3 days from Wednesday, 17. February to Friday, 19. February 2027 in Tokyo.

FAIR LOCATION

Tokyo Big Sight

Tokyo, Japan

FREQUENTLY ASKED QUESTIONS

The IC & SENSOR PACKAGING EXPO fair takes place in Tokyo, at the Tokyo Big Sight.

Visit the IC & SENSOR PACKAGING EXPO from 17. - 19. February 2027.

The IC & SENSOR PACKAGING EXPO takes place annually.

The IC & SENSOR PACKAGING EXPO is an exhibition for Manufacturing Technology, Electronics and Electrical.

SECTORS

Electrical

Electronics

Manufacturing Technology

Packaging

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FAIR INFORMATION

Date

17-19 February 2027
Period

Annually
Fair Contact

inw.jp@rxglobal.com
Target Audience

Yalnızca Profesyonel Ziyaretçiler
Local Time

22:19 h (UTC +09:00)

FAIR ORGANIZER

RX Japan Ltd.

Address

18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - Ku, 1630570 Tokyo, Japan
E-mail

info.jp@rxglobal.com
Website

http://www.rxjapan.jp