Bondexpo

International trade fair for bonding technology

Stuttgart, Germany

06-08 October 2026

Commodities Industrial Engineering Industry Material Handling Measurement Technology Plastics Process Technology

64 days left

ABOUT THE FAIR

The Bondexpo, hosted in the stunning venue of Messe Stuttgart, has become a pivotal gathering for the international adhesive technology industry since its inception in 2007 by P. E. Schall GmbH & Co. KG. As an annual event taking place every October, it has established itself both as a global information and knowledge hub, and as a central event for professionals, visitors, and exhibitors. What sets the Bondexpo apart is its comprehensive portrayal of the entire process chain of joining and bonding through techniques such as gluing, casting, sealing, and foaming. Not only are innovative solutions for current practical applications showcased, but attendees also gain insights into future challenges and developments in the industry. With a special emphasis on the use of new adhesives – especially in lightweight construction for vehicles, devices, and equipment – the exhibition underscores the growing significance of these technologies. Another highlight of the Bondexpo is its synergy with Motek, the world's leading trade fair for production and assembly automation. The close link between the two fairs allows visitors to recognize the relevance of adhesive, casting, sealing, and foaming processes in the context of highly automated processing systems like handling and robotics. In addition to the exhibition, Bondexpo offers an exhibitor forum where industry experts present current topics and products of adhesive technology through lectures. This interactive component makes the Bondexpo a vibrant platform for exchange and continued learning. In conclusion, the Bondexpo is not just an exhibition but an experience – an annual highlight for all who are passionate about the world of adhesive technology. Located in Stuttgart, it attracts thousands of visitors, reaffirming its position as an indispensable event in the industry. Visitors and exhibitors meet for the eighteenth time on the Bondexpo on 3 days from Tue., 06.10.2026 to Thur., 08.10.2026 in Stuttgart.

FAIR LOCATION

Messe Stuttgart

Stuttgart, Germany

FREQUENTLY ASKED QUESTIONS

The Bondexpo fair takes place in Stuttgart, at the Messe Stuttgart.

Visit the Bondexpo from 06. - 08. October 2026.

The Bondexpo takes place annually.

The Bondexpo is an exhibition for Commodities, Measurement Technology and Material Handling.

SECTORS

Commodities

Industrial Engineering

Industry

Material Handling

Measurement Technology

Plastics

Process Technology

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FAIR INFORMATION

Date

06-08 October 2026
Period

Annually
Founded Year

2007
Fair Contact

info@messe-sinsheim.de
Target Audience

Yalnızca Profesyonel Ziyaretçiler
Local Time

06:45 h (UTC +02:00)

FAIR ORGANIZER

P. E. Schall GmbH & Co. KG

Address

Gustav-Werner-Str. 6, 72636 Frickenhausen, Germany, Tel: +49 (0)7025 92060, Fax: +49 (0)7025 9206880
E-mail

info@schall-messen.de
Website

http://www.schall-messen.de